Smart And Neuromorfic Biointerfacing Systems
Contact person: Erokhin Victor
Our Technologies

Activities of this AdR are carried out in 3 laboratories:


Physical.chemical laboratory equipped for the deposition of polymeric thin films employing several techniques:

  • Langmuir Schaefer
  • Langmuir Blodgett
  • Spin coating
  • Dip coating
  • Electrodeposition
  • Layer-by-Layer

Access to FTIR spectroscopy and UV-VIS spectrophotometry



Thanks to the partnership with Politecnico di Torino, a cleanroom is available at the IMEM@PoliTo Unit ( for the implementation of micro- and nano-scale technological processes. The cleanroom is composed of ISO 14644 Class5 (U.S Fed-Std 209D Class 100) and ISO 14644 Class6 (U.S Fed-Std 209D Class 1000) areas. The cleanroom hosts the main micro-nano scale technologies for the fabrication of MEMS, microsensors, microfluidics and for their integration with nanostructures:

  • Double side Mask Aligner
  • Laser Direct Writer
  • Reactive Ion Etcher (RIE) and Deep Reactive Ion Etcher (DRIE)
  • Chemical Benches for Lithographic processes and for Wet Etching
  • E-Gun Evaporator
  • Rapid Thermal Annealer (RTA)
  • ICP-Plasma Enhanced Chemical Vapor Deposition (ICP-PECVD)
  • Graphene deposition furnace
  • Electroplating
  • Hot Embossing
  • CNC Milling
  • Micro Electro-Discharge Machining.

The Lab is also provided with a significant set of Rapid Prototyping & Additive Manufacturing technologies: (i) Ink-Jet 3D Printing, (ii) 3D Plastic Sintering, (iii) MicroStereoLithography, (iv) Electrospinning, (v) Ink-Jet Printing, (vi) 2 Photon Polymerization (2PP).

One of the Labs present in IMEM is equipped to provide the fabrication of polymeric smart nano and micro containers in the form of capsules and freestanding microchambers employing the layer-by-layer and the one-step dip coating techniques.

In IMEM there is also another laboratory, joint with the Irish company Camlin Group LtD, focused on the development and prototyping of organic devices printed by means of the Optomec Aerosol Jet 200 Series printer. This printer allows the deposition of a wide range of inks (metallic, organic, dielectric, biological, etc ...) with a micrometric definition (less than 8 mm) on different types of substrates (flexible and non-flexible). The laboratory is also equipped to perform electrical characterizations with the National Instrument apparatus (PXIe-8370 equipped with PXIe-4145), electrochemical characterizations by means of the Palm Sens 4 measurement interface and in vivo acquisitions of biological signals with the OpenBCI Cytron board.

Access to: SEM-FIB



This laboratory is divided into two different laboratories. The first one is focused on the inspection of electronic devices and on the optical characterization of biological samples thanks to the NIKON-ECLIPSE Ni-E optical microscope equipped with DS-Qi2 CAMERA and with fluorescence. The second laboratory is dedicated to the electrical characterizations of the single or integrated in more complex circuits electronic devices thanks to the National Instrument measuring apparatus (Chassis Ni PXle-1073; Modules: SMU NiPXle 4138/39, NiPXl- 6289). In addition, the laboratory offers a small facility for the prototyping and programming of interactive systems (sensor + actuator) thanks to various Arduino 

Fluorescence Optical Microscope Nikon Ni-E with Camera Type: Nikon DS-Qi2
Fluorescence Optical Microscope Nikon Ni-E with Camera Type: Nikon DS-Qi2


Parylene coating Technology Diener P6

Parylene coating Technology Diener P6

Brand: Diener

Model: P6


  • Protective layers
  • Freestanding substrates
  • Devices encapsulation

Technical data:

  • Coating thickness: 0,5 mm a 30 mm
  • Rotating holder equipped with six stabs with 170 mm diameter
  • The coating is not affected by edges or substrate defects
  • Evaporation of different Parylene materials: N,D,C,F-VT4

Parylene properties:

  • Biocompatible material
  • Transparent in the visible spectra
  • Low friction coefficient
  • Dielectric material
  • Chemical resistance

NOVASCAN PSD Thermal UV-Ozone Cleaner System



  • Cleaning silicon wafers and several substrates (glass, organic substrates etc…)
  • Removing photoresist
  • UV polymers activation
  • Cleaning AFM, SEM and TEM samples
  • Increasing wettability
  • Removing organic impurities
  • Bonding PDMS